CouncilIQ
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Estimated Value
£1,160,000
Deadline
1 September 2026
Contract Period
Not specified
Procurement Method
open
CPV Code
38000000 - Laboratory, optical and precision equipments (excl. glasses)
Extracted from the notice; check the official documents.
Bidders will be required to have an average yearly turnover of a minimum of 2,320,000 GBP for the last 3 (three) years, to ensure the University is protected from any unforeseen financial risks that…
https://www.publictendersscotland.publiccontractsscotland.gov.uk/esop/pts-host/public/pts/web/login.html
Background The UK urgently requires a sovereign, open-access advanced semiconductor packaging capability to close a well-evidenced market failure. Today, UK innovators in photonics and power electronics rely on overseas Outsourced Semiconductor Assembly and Test (OSAT) facilities for scaling to volume packaging, which fragments the supply chain, extends lead times, increases Intellectual Property (IP) leakage risk, and exposes critical technologies to geopolitical disruption. The National Centre for Advanced Semiconductor Packaging (NCASP) is the missing link that converts research excellence into manufacturable products. NCASP is creating an integrated, industry-led scale-up facility that connects UK device design to domestic, high-volume packaging, test and metrology – reducing time-to-market and anchoring value onshore. Description The University of Strathclyde has a requirement for automatic die inspection sorter for photonics packaging applications.
No award has been published for this tender, and we have no earlier award notices from University of Strathclyde in this sector.
From award notices on Find a Tender and Contracts Finder. SME or Large is the size the supplier declared on the notice (or, where it is silent, on its latest notice). Values are as published.